Advanced heterogeneous integration technology trend for cloud and edge-Reference-Cited by-同舟云学术

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Advanced heterogeneous integration technology trend for cloud and edge

Published:2017-02 Issue: Volume: Page:
ISSN:
Container-title:2017 IEEE Electron Devices Technology and Manufacturing Conference (EDTM)
language:
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Author:

Yu Douglas C. H.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7939937/7947483/07947598.pdf?arnumber=7947598

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Challenges and Innovations in Fully Integrated DC-DC Converters for IoT and Modern Computing Platforms;2024 IEEE Custom Integrated Circuits Conference (CICC);2024-04-21

2. Hybrid Bonding for Ultra-High-Density Interconnect;Journal of Electronic Packaging;2024-03-08

3. Hybrid Substrates for Heterogeneous Integration;Journal of Electronic Packaging;2023-08-11

4. A Thermally Friendly Bonding Scheme for 3D System Integration;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

5. Reliability Performance on Fine-Pitch SoIC™ Bond;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

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