Liquid Surface Tension-Driven Chip Self-Assembly Technology with Cu-Cu Hybrid Bonding for High-Precision and High-Throughput 3D Stacking of DRAM
Author:
Affiliation:
1. Tohoku University,Sendai,Japan
2. Yamaha Robotics Holdings Co., Ltd.,Tokyo,Japan
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10564841/10564831/10565276.pdf?arnumber=10565276
Reference24 articles.
1. Heterogeneous and Chiplet Integration Using Organic Interposer (CoWoS-R)
2. Multi-Stack Hybrid Cu Bonding Technology Development Using Ultra-Thin Chips;Kim
3. Thermal Improvement of HBM with Joint Thermal Resistance Reduction for Scaling 12 Stacks and Beyond;Taehwan
4. C2W Hybrid Bonding Interconnect Technology for Higher Density and Better Thermal Dissipation of High Bandwidth Memory
5. A Thermally Friendly Bonding Scheme for 3D System Integration
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