C2W Hybrid Bonding Interconnect Technology for Higher Density and Better Thermal Dissipation of High Bandwidth Memory-Reference-Cited by-同舟云学术

C2W Hybrid Bonding Interconnect Technology for Higher Density and Better Thermal Dissipation of High Bandwidth Memory

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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Author:

Kim Kibum¹,Lim Sanghyuk²,Jung Dongwook¹,Choi Jeongyun²,Na Song.³,Yeom Jaehvun.¹,Lee Miseon⁴,Kim Jongyeon⁵,Kwon Jongoh³,Moon Ki-Il²,Lee Gyuje²,Lee Kangwook⁵

Affiliation:

1. SK hynix Inc.,Ichon-si,Rebublic of Korea

2. SK hynix Inc.,Seoul-si,Republic of Korea

3. SK hynix Inc.,Dongtan-si,Rebublic of Korea

4. SK hynix Inc.,Hanam-si,Rebublic of Korea

5. SK hynix Inc.,Suwon-si,Republic of Korea

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195713.pdf?arnumber=10195713

Reference5 articles.

1. Thermal and Electrical Performance of Direct Bonding Interconnect technology for 2.5D and 3D Integrated Circuits;agrawal;2017 IEEE 67th Electron Components Technol Conf,0

2. Scaling Package Interconnects Below 20um Pitch with Hybrid Bonding;gao;2018 IEEE 68th Electronic Components and Technology Conference,0

3. SoIC for Low-Temerature, Multi-Layer 3D Memory Integration;chen;2020 IEEE 70th Electronic Components and Technology Conference (ECTC),0

4. An Overview of Patterned Metal/Dielectric Surface Bonding: Mechanism, alignment and characterization;di cioccio;Journal of The Electrochemical Society,0

5. A Study on Memory Stack Process by Hybrid Copper Bonding (HCB) Technology

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