Substrate Silicon Wafer Integrated Fan-out Technology (S-SWIFT<sup>®</sup>) Packaging with Fine Pitch Embedded Trace RDL-Reference-Cited by-同舟云学术

Substrate Silicon Wafer Integrated Fan-out Technology (S-SWIFT^®) Packaging with Fine Pitch Embedded Trace RDL

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Jin SangHyun¹,Do WonChul¹,Jeong JinSuk¹,Cha HyunGoo¹,Jeong YunKyung¹,Khim JinYoung¹

Affiliation:

1. Amkor Technology Korea, Inc.,R&D,Incheon,Republic of Korea

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816615.pdf?arnumber=9816615

Reference9 articles.

1. High Performance, High Density RDL for Advanced Packaging

2. Next generation panel-scale RDL with ultra small photo vias and ultra-fine embedded trenches for low cost 2.5D interposers and high density fan-out WLPs;liu;Proc Electronic Components Technology Conf (ECTC),2016

3. Novel Approach to Highly Robust Fine Pitch RDL Process

4. Advances in Photosensitive Polymer Based Damascene RDL Processes: Toward Submicrometer Pitches With More Metal Layers

5. Superconformal film growth: Mechanism and quantification

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4. Inorganic Capping Layers in RDL Technologies: Process Advantages and Reliability;JOM;2023-08-15

5. Electromigration Performance of Fine-Line Cu Redistribution Layer (RDL) for High-Density Fan-Out Packaging;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05