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BEOL FeFET SPICE-Compatible Model for Benchmarking 3-D Monolithic In-Memory TCAM Computation

  • Published:2023-12 Issue:12 Volume:70 Page:6286-6292
  • ISSN:0018-9383
  • Container-title:IEEE Transactions on Electron Devices
  • language:
  • Short-container-title:IEEE Trans. Electron Devices

Author:

Kumar Shubham1ORCID,Prakash Om2ORCID,Chauhan Yogesh Singh3ORCID,Amrouch Hussam4ORCID

Affiliation:

1. Chair of Semiconductor Test and Reliability (STAR), University of Stuttgart, Stuttgart, Germany

2. Om Prakash resides, Newport, U.K

3. Department of Electrical Engineering, Indian Institute of Technology at Kanpur, Kanpur, India

4. Chair of AI Processor Design, Technical University of Munich (TUM), Munich, Germany

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermal Effects on Monolithic 3D Ferroelectric Transistors for Deep Neural Networks Performance;Advanced Intelligent Systems;2024-07-03

2. Monolithic 3D Integration using BEOL FeFET: Reliability, Thermal Effects, and DNN Accuracy;2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM);2024-03-03

3. Benchmarking IWO-based Logic Circuits for Monolithic 3D Integration;2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM);2024-03-03
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