Novel Vertical Channel-All-Around (CAA) In-Ga-Zn-O FET for 2T0C-DRAM With High Density Beyond 4F2 by Monolithic Stacking
Author:
Affiliation:
1. Key Laboratory of Microelectronics Device and Integrated Technology, Institute of Microelectronics of Chinese Academy of Sciences, Beijing, China
2. Huawei Technologies Company, Ltd., Shenzhen, China
Funder
National Natural Science Foundation of China
Strategic Priority Research Program of Chinese Academy of Sciences
National Key Research and Development Program of China
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/16/9741401/09732906.pdf?arnumber=9732906
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1. Facile and Stable n+ Doping Process Via Simultaneous Ultraviolet and Thermal Energy for Coplanar ALD-IGZO Thin-Film Transistors
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3. Impact of hydrogen diffusion on electrical characteristics of IGZO TFTs passivated by SiO2 or Al2O3
4. Hydrogen Impacts of PEALD InGaZnO TFTs Using SiOx Gate Insulators Deposited by PECVD and PEALD
5. Effects of Deposition Temperature on the Device Characteristics of Oxide Thin-Film Transistors Using In–Ga–Zn–O Active Channels Prepared by Atomic-Layer Deposition
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