Middle-of-the-Line Reliability Characterization of Recessed-Diffusion-Contact Adopted sub-5nm Logic Technology

Author:

Kim Seongkyung1,Jung Ukjin1,Choo Seungjin1,Choi Kihyun1,Chung Taejin1,Chung Shinyoung1,Lee Euncheol1,Park Juhun1,Bae Deokhan1,Um Myungyoon1

Affiliation:

1. Samsung Foundry Business, Samsung Electronics,Yong-in si,Republic of Korea

Publisher

IEEE

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Automotive Process Reliability Prediction for 5,7nm using ML;2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC);2023-05-01

2. Reliability Prediction for Automotive 5nm and 7nm Technology node by using Machine Learning based Solution;2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM);2023-03-07

3. Machine Learning Based V-ramp VBD Predictive Model Using OCD-measured Fab Parameters for Early Detection of MOL Reliability Risk;2023 IEEE International Reliability Physics Symposium (IRPS);2023-03

4. Reliability Assessment of 3nm GAA Logic Technology Featuring Multi-Bridge-Channel FETs;2023 IEEE International Reliability Physics Symposium (IRPS);2023-03

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