Automotive Process Reliability Prediction for 5,7nm using ML-Reference-Cited by-同舟云学术

Automotive Process Reliability Prediction for 5,7nm using ML

Published:2023-05-01 Issue: Volume: Page:
ISSN:
Container-title:2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
language:
Short-container-title:

Author:

Jayaram Srividya¹,Lee Hyung Joo²,Kim Dongin³,Choi Sanghyun²,Hong Seungpyo²,Lee Seungjae²,Kwak Doohwan²,Paek Seungwon³,Kwon Minho³,Kim Yeongdo³,Jung Hyobe³,Kissiov Ivan¹,Torres Andres¹,Greeneltch Nathan¹,Tao Melody¹,Lee Ho³

Affiliation:

1. Digital Industries Software,Siemens EDA,Fremont,CA,USA,94538

2. Digital Industries Software,Siemens EDA,Seongnam,Gyeonggi,Republic of Korea,13524

3. Samsung Electronics Co. Ltd.,Foundry Business,Hwaseong,Republic of Korea,Gyeonggi 18448

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10121052/10121025/10121095.pdf?arnumber=10121095

Reference10 articles.

1. Run-to-Run Control of Chemical Mechanical Polishing Process Based on Deep Reinforcement Learning

2. Advanced profile control and the impact of sidewall angle at gate etch for critical nodes

3. A Unified Approach to Interpreting Model Predictions;lundberg;Proceeding NIPS,2017

4. Virtual metrology: how to build the bridge between the different data sources

5. Machine Learning Assisted New Product Setup

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Optimizing High-Product-Mix Manufacturing with Advanced Process Control through Machine Learning-Based Virtual Metrology;2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC);2024-05-13

2. Advanced process control by machine learning-based virtual metrology for high product mix manufacturing;Metrology, Inspection, and Process Control XXXVIII;2024-04-10

3. Enabling process control though predictive design and virtual metrology for high product mix manufacturing;2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM);2024-03-03

4. Cognitive Diagnostics in Automotive using ML;2024 IEEE International Students' Conference on Electrical, Electronics and Computer Science (SCEECS);2024-02-24