Reliability Prediction for Automotive 5nm and 7nm Technology node by using Machine Learning based Solution-Reference-Cited by-同舟云学术

Reliability Prediction for Automotive 5nm and 7nm Technology node by using Machine Learning based Solution

Published:2023-03-07 Issue: Volume: Page:
ISSN:
Container-title:2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
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Author:

Lee Hyung Joo¹,Kim Dongin²,Choi Sanghyun¹,Hong Seungpyo¹,Kwak Doohwan¹,Jayaram Srividya¹,Paek Seungwon²,Kwon Minho²,Kim Yeongdo²,Jung Hyobe²,Kissiov Ivan¹,Tao Melody¹,Torres Andres¹,Greeneltch Nathan¹,Lee Ho²

Affiliation:

1. Siemens EDA, Digital Industries Software

2. Samsung Electronics, Foundry Business

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10102927/10102928/10103011.pdf?arnumber=10103011

Reference8 articles.

1. A Unified Approach to Interpreting Model Predictions;lundberg;Proceeding NIPS,2017

2. Middle-of-the-Line Reliability Characterization of Recessed-Diffusion-Contact Adopted sub-5nm Logic Technology

3. Virtual metrology: how to build the bridge between the different data sources

4. Machine Learning Assisted New Product Setup

5. Improved Semiconductor Process Characterization Using Virtual Cross Metrology;torres;2022 Advanced Process Control Smart Manufacturing Conference (APCSM),2022

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