Modelling Thermal Fatigue in Power Electronics
Author:
Affiliation:
1. Fraunhofer ENAS,Dept. Micro Materials Center
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9758836/9758837/09758893.pdf?arnumber=9758893
Reference8 articles.
1. Studies on Thermo-Mechanical Reliability of High Performance Vehicle Computers Based on a Mock-up System
2. Interface reliability and lifetime prediction of heavy aluminum wire bonds
3. Electro-thermo-mechanical analyses on silver sintered IGBT-module reliability in power cycling
4. Simulation of delamination in composites under high-cycle fatigue
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1. Investigation of an approach for the determination of the current State-of-Health and improvement of service life in power modules;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
2. Finite Element Simulation and Sensitivity Analysis of the Cohesive Parameters for Delamination Modeling in Power Electronics Packages;Materials;2023-07-04
3. Failure Prediction and Analysis of an IGBT Module for Industrial Applications Subjected to Passive and Power Cycling;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
4. Finite elements analyses of early-stage crack propagation in aluminum wire bonds due to power cycling;Microelectronics Reliability;2022-11
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