Studies on Thermo-Mechanical Reliability of High Performance Vehicle Computers Based on a Mock-up System-Reference-Cited by-同舟云学术

Studies on Thermo-Mechanical Reliability of High Performance Vehicle Computers Based on a Mock-up System

Published:2021-04-19 Issue: Volume: Page:
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Container-title:2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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Author:

Dudek Rainer,Doring Ralf,Rzepka Sven,Gromala Przemyslaw,Schindele Jens,Vandevelde Bart

Publisher

IEEE

Link

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. Failure Prediction and Analysis of an IGBT Module for Industrial Applications Subjected to Passive and Power Cycling;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17

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