Electro-thermo-mechanical analyses on silver sintered IGBT-module reliability in power cycling-Reference-Cited by-同舟云学术

Electro-thermo-mechanical analyses on silver sintered IGBT-module reliability in power cycling

Published:2015-04 Issue: Volume: Page:
ISSN:
Container-title:2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
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Author:

Dudek R.¹,Doring R.¹,Rzepka S.¹,Ehrhardt C.²,Gunther M.³,Haag M.⁴

Affiliation:

1. Fraunhofer ENAS, Micro Materials Center Chemnitz, Germany

2. Fraunhofer IZM, Berlin, Germany

3. Robert Bosch GmbH, CR/APJ3, Stuttgart, Germany

4. Bertrandt Ingenieurbuero GmbH, Ingolstadt, Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7095627/7103074/07103139.pdf?arnumber=7103139

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