Author:
Halouani A.,Shqair M.,Khatir Z.,Ibrahim A.,Ouhab M.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference19 articles.
1. Design for reliability of power electronics modules;Lu;Microelectron. Reliab.,2009
2. Homogenization scheme for brittle intergranular decohesion in polycrystalline aggregates;Benabou;Mech. Res. Commun.,2014
3. Model for Power Cycling lifetime of IGBT Modules – various factors influencing lifetime;Bayerer,2008
4. Intergranular thermal fatigue damage evolution in SnAgCu lead-free solder;Erinc;Mech. Mater.,2008
5. Delamination modeling for power packages by the cohesive zone approach;Dudek,2012
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