Funder
Christian Doppler Forschungsgesellschaft
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference26 articles.
1. Semiconductor power devices physics, characteristics, reliability;Lutz,2011
2. Selected failure mechanisms of modern power modules;Ciappa;Microelectron. Reliab.,2002
3. Advanced packaging yields higher performance and reliability in power electronics;Bayerer;Microelectron. Reliab.,2010
4. Semiconductor devices — mechanical and climatic test methods — Part 34;IEC 60749-34,2010
5. On the effect of power cycling stress on IGBT modules
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34 articles.
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