The Effect of Geometric and Material Uncertainty on Debonding Warpage in Fan-Out Panel Level Packaging-Reference-Cited by-同舟云学术

The Effect of Geometric and Material Uncertainty on Debonding Warpage in Fan-Out Panel Level Packaging

Published:2023-04-17 Issue: Volume: Page:
ISSN:
Container-title:2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
language:
Short-container-title:

Author:

Chen H. L.¹,Chiang K. N.¹

Affiliation:

1. National Tsing Hua University,Advanced Microsystem Packaging and Nano-Mechanics Research Lab,Dept. of Power Mechanical Engineering,Hsinchu,Taiwan, R.O.C,300

Funder

National Science and Technology Council

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10100701/10100725/10100786.pdf?arnumber=10100786

Reference17 articles.

1. Prediction of Fan-out Panel Level Warpage using Neural Network Model with Edge Detection Enhancement

2. Warpage Analysis of Fan-Out Panel-Level Packaging Using Equivalent CTE

3. Warpage and Simulation Analysis of Panel Level FO-WLCSP Using Equivalent CTE

4. Prediction of Fan-Out Level Packaging Warpage using PSO-based Modified Convolutional Neural Network model with Laplacian Filter

5. A Novel Design of Temporary Bond Debond Adhesive Technology for Wafer-Level Assembly

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Metrology of Warpage in Silicon Wafers Using X-ray Diffraction Mapping;2024-07-30

2. Metrology of Silicon Wafers Through Synchrotron Section Topography and X-Ray Diffraction Imaging;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-07

3. WITHDRAWN: Metrology of warpage in silicon wafers using X-ray diffraction mapping;Results in Physics;2024-07

4. Warpage Estimation of Panel-Level Packaging by AI-assisted Design on Simulation;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07

5. Simulation modeling of 600mm X600mm fan-out panel level for warpage behavior based on chip first;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05