WITHDRAWN: Metrology of warpage in silicon wafers using X-ray diffraction mapping
Author:
Funder
Irish Research Council
Publisher
Elsevier BV
Reference30 articles.
1. Q. Ding, M. Wang, H. Xing, Q. He, L. Ma, W. Qiu, Investigation of a fitting phase-shift method for stress analysis using infrared photoelasticity, Opt Lasers Eng vol. 149, no. 106786, 2022, doi: 10.1016/j.optlaseng.2021.106787.
2. C. Bu, R. Li, Q. Tang, “Micro-crack defects detection of semiconductor Si-wafers based on Barker code laser infrared thermography,” Infrar Phys Technol, vol. 123, no. 104160, 2022,
3. N. Hubble, “Improvements in Decision Making Criteria for Thermal Warpage,” IMAPS 12thInternational Conference and Exhibition on Device Packaging, vol. 001455, pp.10-18, 2016, doi: 10.1016/j.infrared.2022.104160.
4. O.O. Okudur, M. Gonzalez, G. Van den Bosch, M. Rosmeulen, “Scaling-friendly approaches to minimize the magnitude and asymmetry of wafer warpage during 3D NAND fabrication.” Microelectron Reliab, vol. 145, no. 114996, 2023, doi: 10.1016/j.microrel.2023.114996.
5. S. Kim, Y. Jung, J. J. Kim, S. Lee, H. Lee, Y. Kondo, “Reproducible strain measurement in electronic devices by applying an integer multiple to scanning grating in scanning moiré fringe imaging,” AIP Adv, vol. 4, no. 107107, 2014, doi: 10.1063/1.4897379.
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