Author:
Huang G. R.,Chen M. Y.,Chiang K. N.
Cited by
7 articles.
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1. AI-assisted Design for Reliability: Review and Perspectives;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
2. Combining Process Modeling and Machine Learning Technology to Predict the Warpage of the Panel-Level Packaging After Debonding;2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2023-10-25
3. Studying Asymmetric Warpage Behavior of Panel-Level Packages Using Process Modeling Techniques and Viscoelasticity Theory;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
4. The Effect of Geometric and Material Uncertainty on Debonding Warpage in Fan-Out Panel Level Packaging;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
5. RDL Elements' Anisotropic Equivalent Mechanical Material Properties Calculation Based on Machine Learning Method;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07