Author:
Liu S. W,Panigrahy S. K.,Chiang K. N.
Cited by
14 articles.
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1. Literature Review: Global Criticality Assessment Based on Feature Surrogates at the PCBA Levels;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
2. Simulation modeling of 600mm X600mm fan-out panel level for warpage behavior based on chip first;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
3. Integration of Artificial Neural Network and Finite Element Simulation for Package Warpage Prediction;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
4. Simulation Modeling of 600mm X600mm Fan-Out Panel Level for Warpage Behavior Based on Chip First;2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2023-10-25
5. Precise Warpage Control Technology for 12-Inch Bumpless Via-Last Chip-on-Wafer (COW) by Finite Element Method (FEM);2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2023-10-25