Precise Warpage Control Technology for 12-Inch Bumpless Via-Last Chip-on-Wafer (COW) by Finite Element Method (FEM)
Author:
Affiliation:
1. Murata Manufacturing Co., Ltd,Kyoto,Japan
2. Tokyo Institute of Technology,Kanagawa,Japan
3. NAGASE&Co., Ltd,Tokyo,Japan
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10348606/10348630/10348780.pdf?arnumber=10348780
Reference9 articles.
1. Review of Bumpless Build Cube (BBCube) Using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI)
2. Miniaturized 3D Functional Interposer Using Bumpless Chip-on-Wafer (COW) Integration with Capacitors
3. Warpage Control of Liquid Molding Compound for Fan-Out Wafer Level Packaging
4. Prediction of Fan-out Panel Level Warpage using Neural Network Model with Edge Detection Enhancement
5. Warpage Estimation and Demonstration of Panel-Level Fan-Out Packaging With Cu Pillars Applied on a Highly Integrated Architecture
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