Probabilistic approaches and reliability design of power modules
Author:
Publisher
EDP Sciences
Subject
Control and Optimization,Modeling and Simulation
Link
http://www.ijsmdo.org/10.1051/smdo:2008020/pdf
Reference20 articles.
1. P. Towashiraporn, G. Subbarayan, B. McIlvanie, B.C. Hunter, D. Love, B. Sullivan, in Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM, 2002), pp. 854–861
2. B. Vandevelde et al. Journal of Electronic Packaging 125, 498 (2003)
3. Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach
4. Parametric FE-approach to flip-chip reliability under various loading conditions
5. A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending
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1. Importance of test parameters, specimen type and use configuration on the identification of Sn/Ag solder behaviour laws;Microelectronics Reliability;2018-03
2. Adaptive response surface method supporting finite element calculations: an application to power electronic module reliability assessment;Structural and Multidisciplinary Optimization;2016-09-23
3. Identification of the Sn96.5Ag3.5 Law Behavior with the Scatter of the Parameters - Study of Aeronautical Application in Power Module;Advanced Materials Research;2010-05
4. Viscoplastic Behaviour Reliability Analysis of IGBT Module Solders;IFAC Proceedings Volumes;2010
5. Reliability of lead-free solder in power module with stochastic uncertainty;Microelectronics Reliability;2009-06
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