Reliability of lead-free solder in power module with stochastic uncertainty

Author:

Micol A.,Martin C.,Dalverny O.,Mermet-Guyennet M.,Karama M.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference22 articles.

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2. Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach;Yang;Microelectron Reliab,2004

3. Parametric fe-approach to flip-chip reliability under various loading conditions;Wunderle;Microelectron Reliab,2004

4. Parameterized modeling of thermomechanical reliability for csp assemblies;Vandevelde;J Electron Packaging,2003

5. A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending;Leon;Microelectron Reliab,2004

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