A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending-Reference-Cited by-同舟云学术

A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending

Published:2004-12 Issue:12 Volume:44 Page:1977-1983
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Xu Leon,Reinikainen Tommi,Ren Wei,Wang Bo Ping,Han Zhenxue,Agonafer Dereje

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference18 articles.

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3. Creep crack growth prediction of solder joints during temperature cycling––an engineering approach;Syed,1995

4. Syed AR. A review of finite element methods for solder joint analysis, 1996. In: Proceedings of Experimental/Numerical Mechanics in Electronic Packaging, SEM, vol. 1. p. 117–25

5. Syed AR. Factors affecting creep-fatigue interaction in eutectic Sn/Pb solder joints. In: Advances in Electronic Packaging 1997, Interpack97. p. 1535–42

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