Viscoplastic Behaviour Reliability Analysis of IGBT Module Solders-Reference-Cited by-同舟云学术

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Viscoplastic Behaviour Reliability Analysis of IGBT Module Solders

Published:2010 Issue:3 Volume:43 Page:80-85
ISSN:1474-6670
Container-title:IFAC Proceedings Volumes
language:en
Short-container-title:IFAC Proceedings Volumes

Author:

Micol A.,Martin C.,Mermet-Guyennet M.

Publisher

Elsevier BV

Subject

General Medicine

Reference16 articles.

1. “Anticipating Aging Failure Using Feedback Data And Expert Judgment”;Bouzaïene;Reliability Engineering and System Safety,2007

2. Design & Reliability of Solders and Solder Interconnections;Choi,1997

3. Design & Reliability of Solders and Solder Interconnections;Engelmaier,1997

4. Design & Reliability of Solders and Solder Interconnections;Gibson,1997

5. Jacob, P. Held, M. Scacco, P. Wuchen Wu “Reliability testing and analysis of IGBT power semiconductor modules” IEE Colloquium on IGBT Propulsion Drives 1995.

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The research and development of Soldering materials applied in IGBT modules packaging;IOP Conference Series: Materials Science and Engineering;2020-01-01

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