Identification of the Sn96.5Ag3.5 Law Behavior with the Scatter of the Parameters - Study of Aeronautical Application in Power Module

Author:

Micol Alexandre1,Zéanh Adrien1,Dalverny Olivier1,Karama Moussa1

Affiliation:

1. Université de Toulouse

Abstract

This work studies the reliability of power electronic component in aeronautical environment to the ageing eect of the thermal cycling. The structure fatigue is sensitive to the process assembly conditions especially of the soldering process. To correclty evaluate the reliability of the power module, the identication of the solder behavior is one of the rst steps. Anand Model is here identied. Experimental test have to be established to evaluate the parameters of the law. A srt study is made to evaluate the indetiability of the law according to the dierent experimantal test. Then, the scatter of the parameters is evaluated in a context of time series. In the end, the scatter of the parameters is included in a nite element model to understand the inuence of this scatter on the evaluation of the number of cycle before failure.

Publisher

Trans Tech Publications, Ltd.

Subject

General Engineering

Reference7 articles.

1. G. Massiot, C. Munier, A review of creep fatigue failure models in solder material - simpli�ed use of a continuous damage mechanical approach, Euro SIME 2004, 2004, pp.465-472.

2. J. Beck, K. Arnold, Parameter estimation in engineering and science, N. York (ed. ), Wiley, (1977).

3. Chat�eld,C., Analysis of Time Series: An introduction, Fourth Edition, London: Chapman and Hall.

4. G. Wang, Z. Cheng, K. Becker, J. Wilde, Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys ; Journal of Electronic Packaging Vol. 123 Issue 3, 2001, pp.247-253.

5. Durbin, J., and Watson, G. S. (1951) Testing for Serial Correlation in Least Squares Regression, II., Biometrika 38, 159�179.

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