Chemical Mechanical Polishing of Chemical Vapor Deposited Co Films with Minimal Corrosion in the Cu/Co/Mn/SiCOH Patterned Structures-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Chemical Mechanical Polishing of Chemical Vapor Deposited Co Films with Minimal Corrosion in the Cu/Co/Mn/SiCOH Patterned Structures

Published:2017 Issue:5 Volume:6 Page:P276-P283
ISSN:2162-8769
Container-title:ECS Journal of Solid State Science and Technology
language:en
Short-container-title:ECS J. Solid State Sci. Technol.

Author:

Sagi K. V.,Teugels L. G.,van der Veen M. H.,Struyf Herbert,Alety S. R.,Babu S. V.

Publisher

The Electrochemical Society

Subject

Electronic, Optical and Magnetic Materials

Reference59 articles.

1. Chemical Mechanical Planarization: Slurry Chemistry, Materials, and Mechanisms

2. Copper chemical mechanical planarization (Cu CMP) challenges in 22nm back-end-of-line (BEOL) and beyond

3. Self-forming diffusion barrier layer in Cu–Mn alloy metallization

4. Electrical and reliability characterization of CuMn self forming barrier interconnects on low-k CDO dielectrics

5. Study of Chemical Vapor Deposition of Manganese on Porous SiCOH Low-k Dielectrics Using Bis(ethylcyclopentadienyl)manganese

Cited by 40 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Experimental and Density Functional Theory Study of Inhibitors on Cobalt Corrosion for Chemical Mechanical Planarization Process;ECS Journal of Solid State Science and Technology;2024-04-01

2. Effects of two mild amino acids on benzotriazole residue desorption during cobalt post-chemical mechanical polishing cleaning: Experimental and theoretical studies;Colloids and Surfaces A: Physicochemical and Engineering Aspects;2024-02

3. Synergistic Control on Co/Cu Galvanic Corrosion and Its Application for Co Barrier Chemical Mechanical Planarization in Alkaline Slurry;Journal of The Electrochemical Society;2024-01-01

4. Study on synergetic effect of potassium pyrophosphate and benzotriazole on chemical mechanical planarization of GLSI low-technology node molybdenum barrier layer;Materials Science in Semiconductor Processing;2023-12

5. Polishing mechanisms of various surfactants in chemical mechanical polishing relevant to cobalt interconnects;The International Journal of Advanced Manufacturing Technology;2023-09-07

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3