Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference35 articles.
1. Chemical mechanical polishing of chemical vapor deposited Co films with minimal corrosion in the Cu/Co/Mn/SiCOH patterned structures;Sagi;ECS J. Solid State Sci. Technol.,2017
2. The effect of potassium pyrosulfate and H2O2 on Cu/Co galvanic corrosion and removal rate during CMP;Li;Electroplat. Finish.,2022
3. Effect of novel green inhibitor on corrosion and chemical mechanical polishing properties of cobalt in alkaline slurry;Li;Mater. Sci. Semicond. Process.,2022
4. Inhibition mechanism of benzotriazole in copper chemical mechanical planarization;Li;Appl. Mech. Mater.,2014
5. Controlling the galvanic corrosion of copper during chemical mechanical planarization of ruthenium barrier films;Peethala;Electrochem. Soc. Interface,2011