Chemical Mechanical Planarization: Slurry Chemistry, Materials, and Mechanisms
Author:
Affiliation:
1. IBM T.J. Watson Research Center, Yorktown Heights, New York 10598, and Dow Electronic Materials, Newark, Delaware 19713
Publisher
American Chemical Society (ACS)
Subject
General Chemistry
Link
https://pubs.acs.org/doi/pdf/10.1021/cr900170z
Reference174 articles.
1. Advancing the state of the art in high-performance logic and array technology
2. Tribology In Chemical-Mechanical Planarization
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