Author:
Kurteva Kiril I.,Castro Luis Guillermo,Trujillo-Sevilla Juan M.,Gaudestad Jan O.,van Haren Richard,van Dijk Leon,Otten Ronald
Reference7 articles.
1. Intra-field stress impact on global wafer deformation
2. Characterization and mitigation of overlay error on silicon wafers with nonuniform stress;Brunner,2014
3. Wafer-shape based in-plane distortion predictions using superfast 4G metrology;van Dijk,2017
4. New high repeatability wafer geometry measurement technique for full 200mm and 300mm blank wafers
5. Wavefront phase measurement of striae in optical glass