Intra-field stress impact on global wafer deformation

Author:

van Haren Richard J. F.,Otten Ronald,Singh Subodh,Singh Amandev,van Dijk Leon,Owen David,Anberg Doug,Mileham Jeffrey,Gu Yajun,Hermans Jan

Publisher

SPIE

Reference16 articles.

1. Lithography overlay control improvement using patterned wafer geometry for sub 22 nm technology nodes;Peterson,2015

2. Improvement of process control using wafer geometry for enhanced manufacturability of advanced semiconductor devices;Lee,2015

3. Characterization of wafer geometry and overlay error on silicon wafers with nonuniform stress

4. Simulation of nonuniform wafer geometry and thin film residual stress on overlay errors;Veeraraghaven,2011

5. Characterization of Deformation Induced by Micro-Second Laser Anneal Using CGS Interferometry;Owen,2008

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