Characterization and mitigation of local wafer deformations introduced by direct wafer-to-wafer bonding-Reference-Cited by-同舟云学术

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Characterization and mitigation of local wafer deformations introduced by direct wafer-to-wafer bonding

Published:2024-04-09 Issue: Volume:12496 Page:19
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Container-title:Novel Patterning Technologies 2024
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Author:

van Haren Richard J. F.,Li Suwen,Baars Mart,Minghetti Blandine,van Dijk Leon,Mendes Ivanie,Abadie Karine,Pourteau Marie-Line,Mauguen Gaelle,May Michael,Balan Viorel,Fournel Frank,Pain Laurent,Plach Thomas,Probst Gernot,Wimplinger Markus

Publisher

SPIE

Reference12 articles.

1. Intel PowerVia Technology: Backside Power Delivery for High Density and High-Performance Computing;Walid;VLSI,2023

2. Enabling layer transfer and back-side power delivery network applications by wafer bonding and scanner correction optimizations;Richard,2023

3. Wafer-shape based in-plane distortion predictions using Superfast 4G metrology;Leon,2017

4. Intra-field stress impact on global wafer deformation;Richard,2019

5. New technique for measuring free-form wafer shape to enable wafer distortion predictions;Kiril,2023

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