Wave front phase imaging for silicon wafer metrology-Reference-Cited by-同舟云学术

Wave front phase imaging for silicon wafer metrology

Published:2022-10-03 Issue: Volume: Page:
ISSN:
Container-title:Novel Optical Systems, Methods, and Applications XXV
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Author:

Trujillo-Sevilla Juan M.,Roqué-Velasco Alex,Jesús Sicilia Miguel,Casanova-González Óscar,Rodríguez-Ramos José Manuel,Gaudestad Jan O.

Publisher

SPIE

Reference14 articles.

1. High speed roughness measurement on blank silicon wafers using wave front phase imaging;Trujillo-Sevilla,2020

2. Role Of Process-induced Wafer Geometry Changes In Advanced Semiconductor Manufacturing;Turner,2014

3. SPIE Advanced Lithography Conference 2017, “Wafer-shape based in-plane distortion predictions using superfast 4G metrology”, February 2017, San Jose, CA, USA, Leon van Dijk, Jeffrey Mileham, Ilja Malakhovsky, David Laidler, Harold Dekkers,

4. Stria measurement using wave front phase imaging on an artificial plate

5. Transport Intensity Equation (TIE) explained: https://en.wikipedia.org/wiki/Transport-of-intensity_equation

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