New wave front phase sensor used for 3D shape measurements of patterned silicon wafers
Author:
Publisher
SPIE
Reference23 articles.
1. “INTERNATIONAL ROADMAP FOR DEVICES AND SYSTEMS™”, 2022 EDITION on METROLOGY
2. Leon van Dijk, Jeffrey Mileham, Ilja Malakhovsky, David Laidler, Harold Dekkers, Sven Van Elshocht, Doug Anberg, David M. Owen, Richard van Haren, “Wafer-shape based in-plane distortion predictions using superfast 4G metrology,” Proc. SPIE 10145, Metrology, Inspection, and Process Control for Microlithography XXXI, 101452L (28 March 2017)
3. Richard van Haren, Ronald Otten, Subodh Singh, Amandev Singh, Leon van Dijk, David Owen, Doug Anberg, Jeffrey Mileham, Yajun Gu, Jan Hermans, “Intra-field stress impact on global wafer deformation,” Proc. SPIE 10959, Metrology, Inspection, and Process Control for Microlithography XXXIII, 109591I (26 March 2019)
4. T. Brunner, V. Menon, C. Wong, N. Felix, M. Pike, O. Gluschenkov, M. Belyansky, P. Vukkadala, S. Veeraraghavan, S. Klein, C. H. Hoo, J. Sinha, “Characterization and mitigation of overlay error on silicon wafers with nonuniform stress,” Proc. SPIE 9052, Optical Microlithography XXVII, 90520U (31 March 2014)
5. Characterization of wafer geometry and overlay error on silicon wafers with nonuniform stress
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3