Effect of entropy production on microstructure change in eutectic SnPb flip chip solder joints by thermomigration
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2385205
Reference14 articles.
1. Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing
2. Failure Modes of Flip Chip Solder Joints Under High Electric Current Density
3. Thermomigration in SnPb composite flip chip solder joints
4. Thermomigration in eutectic SnPb alloy
5. Effect of the combination of electromigration and thermomigration on phase migration and partial melting in flip chip composite SnPb solder joints
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