Failure Modes of Flip Chip Solder Joints Under High Electric Current Density-Reference-Cited by-同舟云学术

Failure Modes of Flip Chip Solder Joints Under High Electric Current Density

Published:2004-09-15 Issue:2 Volume:127 Page:157-163
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Basaran C.¹,Ye H.¹,Hopkins D. C.¹,Frear D.²,Lin J. K.²

Affiliation:

1. Electronic Packaging Laboratory, University at Buffalo, SUNY, Buffalo, New York

2. Freescale semiconductor Inc., Tempe, Arizona

Abstract

The failure modes of flip chip solder joints under high electrical current density are studied experimentally. Three different failure modes are reported. Only one of the failure modes is caused by the combined effect of electromigration and thermomigration, where void nucleation and growth contribute to the ultimate failure of the module. The Ni under bump metallization–solder joint interface is found to be the favorite site for void nucleation and growth. The effect of pre-existing voids on the failure mechanism of a solder joint is also investigated

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/127/2/157/5677691/157_1.pdf

Reference28 articles.

1. Electromigration of Eutectic SnPb Solder Interconnects for Flip Chip Technology;Lee;J. Appl. Phys.

2. Electromigration of Eutectic SnPb and SnAg3.8Cu0.7 Flip Chip Solder Bumps and Under-bump Metallization;Lee;J. Appl. Phys.

3. Experiment Study on Reliability of Solder Joints Under Electrical Stressing-Nano-indentation, Atomic Flux Measurement;Ye

4. Failure Modes and FEM Analysis of Power Electronic Packaging;Ye;Finite Elem. Anal. Design

5. Thermomigration in Pb-Sn Solder Joints Under Joule Heating during Electric Current Stressing;Ye;Appl. Phys. Lett.

Cited by 36 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Optimal performance and cost-effective design of BGA solder joints using a deterministic design optimization (DDO) under real operating conditions;Microelectronics Reliability;2023-07

2. Effects of Interconnect Shape and Thermal-Electro-Migration on Solder Creep of Copper-Pillar Flip Chip Joints;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-08

3. Microstructural and compositional evolution of SAC305/TiN composite solder under thermal stressing;Soldering & Surface Mount Technology;2021-12-02

4. Effective Solder for Improved Thermo-Mechanical Reliability of Solder Joints in a Ball Grid Array (BGA) Soldered on Printed Circuit Board (PCB);Journal of Electronic Materials;2020-11-05

5. Microstructural, compositional and hardness evolutions of 96.5Sn–3Ag–0.5Cu/TiC composite solder under thermo-migration stressing;Journal of Materials Science: Materials in Electronics;2020-05-02