Effects of Interconnect Shape and Thermal-Electro-Migration on Solder Creep of Copper-Pillar Flip Chip Joints
Author:
Affiliation:
1. State Key Laboratory of High Performance Complex Manufacturing, School of Mechanical and Electronical Engineering, Central South University, Changsha, China
Funder
National Natural Science Foundation of China
National Natural Science Foundation of China’s joint fund for regional innovation and development
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/5503870/9868249/09831992.pdf?arnumber=9831992
Reference26 articles.
1. Intermetallic Compound Growth and Reliability of Cu Pillar Bumps Under Current Stressing
2. Thermomigration in lead-free solder joints
3. Influence of Thermomigration on Lead-Free Solder Joint Mechanical Properties
4. Experimental Damage Mechanics of Micro/Power Electronics Solder Joints under Electric Current Stresses
5. Measurement of high electrical current density effects in solder joints
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