Thermomigration in SnPb composite flip chip solder joints
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2192694
Reference10 articles.
1. Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing
2. Failure Modes of Flip Chip Solder Joints Under High Electric Current Density
3. Proceedings of the 55th Electronic Components and Technology Conference (ECTC);Lai Y. S.,2005
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