Phase field simulation of interface evolution behavior of copper–tin micro-solder joints under thermal–mechanical–electrical coupling-Reference-Cited by-同舟云学术

Phase field simulation of interface evolution behavior of copper–tin micro-solder joints under thermal–mechanical–electrical coupling

Published:2024-04-23 Issue: Volume: Page:1-19
ISSN:0169-4243
Container-title:Journal of Adhesion Science and Technology
language:en
Short-container-title:Journal of Adhesion Science and Technology

Author:

Zhang Long¹,Guo Hao¹,Yin Limeng²,Zhang Hehe²,Yao Zongxiang²

Affiliation:

1. Department of Theoretical and Applied Mechanics, School of Civil Engineering and Architecture, Chongqing University of Science and Technology, Chongqing, PR China

2. School of Metallurgy and Materials Engineering, Chongqing University of Science and Technology, Chongqing, PR China

Funder

National Natural Science Foundation of China

Natural Science Foundation of Chongqing

Chongqing Talent Plan Project

Jiangxi Key Laboratory of Forming and Joining Technology for Aerospace Components, Nanchang Hangkong University

Publisher

Informa UK Limited

Link

https://www.tandfonline.com/doi/pdf/10.1080/01694243.2024.2343695

Reference30 articles.

1. Study on the microstructure and mechanical property of Cu-foam modified Sn3.0Ag0.5Cu solder joints by ultrasonic-assisted soldering

2. Size effect on IMC growth in micro-scale Sn-3.0Ag-0.5Cu-0.1TiO2 solder joints in reflow process

3. Joining mechanism, microstructure, and mechanical properties of AZ31/6061 joint prepared by pouring fusion welding process assisted with Zn-xSn brazing filler

4. Effect of the microstructure of IMCs and zinc accumulation on the mechanical properties of aluminum/galvanized steel joints in the VP-CMT process

5. Effects of Al and Fe additions on microstructure and mechanical properties of SnAgCu eutectic lead-free solders