Improvement of thermomigration resistance in lead-free Sn3.5Ag alloys by Ag interlayer-Reference-Cited by-同舟云学术

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Improvement of thermomigration resistance in lead-free Sn3.5Ag alloys by Ag interlayer

Published:2020-12 Issue: Volume:847 Page:156429
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Lin Yu-Fang,Hao Yu-Chuan,Ouyang Fan-Yi

Funder

Ministry of Science and Technology of Taiwan

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference30 articles.

1. Thermomigration in solder joints;Chen;Mater. Sci. Eng. R Rep.,2012

2. Effect of entropy production on microstructure change in eutectic SnPb flip chip solder joints by thermomigration;Ouyang;Appl. Phys. Lett.,2006

3. Thermomigration in flip-chip SnPb solder joints under alternating current stressing;Hsiao;Appl. Phys. Lett.,2007

4. Effect of temperature on microstructural evolution of solder alloys under thermomigration;Lin;J. Appl. Phys.,2019

5. Thermomigration in SnPb composite flip chip solder joints;Huang;Appl. Phys. Lett.,2006

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2. Inhibition of roof-type Cu6Sn5 grains on migration of Cu atoms under temperature gradient;Journal of Materials Science;2023-12-27

3. Effects of In addition on microstructure and properties of SAC305 solder;Transactions of Nonferrous Metals Society of China;2023-11

4. Study on Ni-GNSs enhanced Sn2.5Ag0.7Cu0.1RE/Cu solder joints β-Sn grain orientation and interfacial IMC growth kinetics under constant temperature thermomigration;Materials Characterization;2023-11

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