Thermomigration in flip-chip SnPb solder joints under alternating current stressing
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2721136
Reference8 articles.
1. Recent advances on electromigration in very-large-scale-integration of interconnects
2. Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing
3. Thermomigration in SnPb composite flip chip solder joints
4. Thermomigration in eutectic SnPb alloy
5. Effect of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints under accelerated electromigration
Cited by 48 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Inhibition of roof-type Cu6Sn5 grains on migration of Cu atoms under temperature gradient;Journal of Materials Science;2023-12-27
2. Size Effect on the Electromigration Characteristics of Flip Chip Pb-free Solder Bumps;Electronic Materials Letters;2022-07-04
3. A study on the effects of electrical and thermal stresses on void formation and migration lifetime of Sn3.0Ag0.5Cu solder joints;Soldering & Surface Mount Technology;2021-10-27
4. In-situ Determination of Specimen Temperature during Electromigration Testing of Solder Joint;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06
5. Improvement of thermomigration resistance in lead-free Sn3.5Ag alloys by Ag interlayer;Journal of Alloys and Compounds;2020-12
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3