Study on Ni-GNSs enhanced Sn2.5Ag0.7Cu0.1RE/Cu solder joints β-Sn grain orientation and interfacial IMC growth kinetics under constant temperature thermomigration
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference39 articles.
1. Development of low-silver content SAC0307 solder alloy with Al2O3 nanoparticles;Tikale;Mater. Sci. Eng. A,2020
2. Effects of graphene oxide on the electromigration lifetime of lead-free solder joints;Ko;J. Mater. Sci. Mater. Electron.,2019
3. Effects of diamond nanoparticles reinforcement into lead-free Sn–3.0 ag–0.5 cu solder pastes on microstructure and mechanical properties after reflow soldering process;Chellvarajoo;Mater. Des.,2015
4. Effect of nano-ZnO particles on wettability, interfacial morphology and growth kinetics of Sn–3.0 Ag–0.5 Cu–xZnO composite solder;Qu;J. Mater. Sci. Mater. Electron.,2019
5. The interfacial intermetallic and shear strength of Ni nanoparticle-decorated reduced graphene oxide reinforced Sn2.5Ag0.5Cu lead-free composite soldering joints;Huo;Adv. Eng. Mater.,2018
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