Study on Ni-GNSs enhanced Sn2.5Ag0.7Cu0.1RE/Cu solder joints β-Sn grain orientation and interfacial IMC growth kinetics under constant temperature thermomigration-Reference-Cited by-同舟云学术

Study on Ni-GNSs enhanced Sn2.5Ag0.7Cu0.1RE/Cu solder joints β-Sn grain orientation and interfacial IMC growth kinetics under constant temperature thermomigration

Published:2023-11 Issue: Volume:205 Page:113263
ISSN:1044-5803
Container-title:Materials Characterization
language:en
Short-container-title:Materials Characterization

Author:

Zhang Chao,Zhang Keke,Gao Yijie,Wang Yuming,Hou Ruiqing

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference39 articles.

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2. Effects of graphene oxide on the electromigration lifetime of lead-free solder joints;Ko;J. Mater. Sci. Mater. Electron.,2019

3. Effects of diamond nanoparticles reinforcement into lead-free Sn–3.0 ag–0.5 cu solder pastes on microstructure and mechanical properties after reflow soldering process;Chellvarajoo;Mater. Des.,2015

4. Effect of nano-ZnO particles on wettability, interfacial morphology and growth kinetics of Sn–3.0 Ag–0.5 Cu–xZnO composite solder;Qu;J. Mater. Sci. Mater. Electron.,2019

5. The interfacial intermetallic and shear strength of Ni nanoparticle-decorated reduced graphene oxide reinforced Sn2.5Ag0.5Cu lead-free composite soldering joints;Huo;Adv. Eng. Mater.,2018

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