1. High-reliability low-Ag-content Sn-Ag-Cu solder joints for electronics applications;Shnawah;J. Electron. Mater.,2012
2. Effects of nano-Al 2 O 3 particles on microstructure and mechanical properties of Sn3 . 5Ag0 . 5Cu composite solder ball grid array joints on Sn/Cu pads;Tsao,2013
3. Development of lead-free Sn–0.7Cu/Al 2 O 3 nanocomposite solders with superior strength Utilizing energy efficient microwave sintering to significantly enhance the tensile response of a lead-free solder Development of lead-free Sn–0.7Cu/Al 2 O 3 nanocompo;Nai;J. Phys. D Appl. Phys. J. Phys. D Appl. Phys. J. Phys. D Appl. Phys.,2008
4. A study of nanoparticles in Sn-Ag based lead free solders;Amagai;Microelectron. Reliab.,2008
5. Development of new multicomponent Sn-Ag-Cu-Bi lead-free solders for low-cost commercial electronic assembly;El-Daly;J. Alloys Compd.,2015