Revealing the strengthening mechanism of Cu–Sn composites joint fabricated via in-situ reaction for power electronic packaging-Reference-Cited by-同舟云学术

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Revealing the strengthening mechanism of Cu–Sn composites joint fabricated via in-situ reaction for power electronic packaging

Published:2024-03 Issue: Volume:895 Page:146252
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Xu Qiman,Cao Yudong,Chen Baishan^ORCID,Zhou Jian,Xue Feng

Publisher

Elsevier BV

Reference38 articles.

1. An Overview of artificial intelligence applications for power electronics;Zhao;IEEE Trans. Power Electron.,2021

2. The changing automotive environment: high-temperature electronics;Johnson;IEEE Trans. Electron. Packag. Manuf.,2004

3. Anisotropic highly conductive joints utilizing Cu-solder microcomposite structure for high-temperature electronics packaging;Tatsumi;Mater. Des.,2022

4. Development of high-temperature solders: review;Zeng;Microelectron. Reliab.,2012

5. State of the art of high temperature power electronics;Buttay;Mater. Sci. Eng. B,2011

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. In-situ compression tests and analysis of strength-ductility synergy in heterogeneous structured copper-tin composite joint;Materials Science and Engineering: A;2024-10

2. Modificated microstructure and enhanced mechanical properties of Cu-Sn-P alloy with rare earth La addition;Materials Today Communications;2024-06

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