Modificated microstructure and enhanced mechanical properties of Cu-Sn-P alloy with rare earth La addition

Author:

Wang Songwei,Yu Kangkang,Chen Shuaifeng,Deng Siying,Song Hongwu,Zhang Shihong

Publisher

Elsevier BV

Reference29 articles.

1. Revealing the strengthening mechanism of Cu–Sn composites joint fabricated via in-situ reaction for power electronic packaging;Xu;Mater. Sci. Eng. A,2024

2. The deformation compatibility and recrystallisation behaviour of the alloy CuSn10P1;Wang;Mater. Charact.,2021

3. Dynamic tensile properties and deformational mechanism of C5191 phosphor bronze;Hu;Rare Met. Mat. Eng.,2017

4. To suppress thermomigration of Cu–Sn intermetallic compounds in flip-chip solder joints;Huang;J. Mater. Res. Technol.,2023

5. D.H. Zhong, Study on improvement of transverse bending property of tin-phosphor bronze strip, Beijing University of Technology 2003 (in Chinese).

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