The microstructure evolution and failure mechanism of Sn37Pb solder joints under the coupling effects of extreme temperature variation and electromigration-Reference-Cited by-同舟云学术

The microstructure evolution and failure mechanism of Sn37Pb solder joints under the coupling effects of extreme temperature variation and electromigration

Published:2023-08 Issue: Volume:36 Page:106651
ISSN:2352-4928
Container-title:Materials Today Communications
language:en
Short-container-title:Materials Today Communications

Author:

Li Shengli,Hang Chunjin^ORCID,Guan Qilong,Tang Xiaojiu,Yu Dan,Ding Ying,Wang Xiuli

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Materials Chemistry,Mechanics of Materials,General Materials Science

Reference34 articles.

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2. Comparative study between the Sn–Ag–Cu/ENIG and Sn–Ag–Cu/ENEPIG solder joints under extreme temperature thermal shock;Tian;J. Mater. Sci. Mater. Electron,2021

3. Interfacial reactions in molten state micro solder joints under current stressing;Li;J. Alloys Compd.,2018

4. Electromigration-induced intermetallic growth and voids formation in symmetrical Cu/Sn/Cu and Cu/Intermetallic compounds (IMCs)/Cu joints;An;J. Mater. Sci. Mater. Electron,2015

5. Interfacial intermetallic growth and mechanical properties of carbon nanotubes reinforced Sn3.5Ag0.5Cu solder joint under current stressing;Xu;J. Alloys Compd.,2014

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