Phase transformation between Cu(In,Sn)2 and Cu2(In,Sn) compounds formed on single crystalline Cu substrate during solid state aging
Author:
Funder
CAS
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4863336
Reference26 articles.
1. Physics and materials challenges for lead-free solders
2. Spalling behavior of interfacial intermetallic compounds in Pb-free solder joints subjected to temperature cycling loading
3. Diffusion and phase transformations during interfacial reaction between lead-tin solders and palladium
4. The early stage dissolution of Ni and the nucleation of Ni–Sn intermetallic compound at the interface during the soldering of Sn–3.5Ag on a Ni substrate
5. Concurrent nucleation, formation and growth of two intermetallic compounds (Cu6Sn5 and Cu3Sn) during the early stages of lead-free soldering
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