Interfacial reactions of 68In–32Bi, 50In–50Bi and 33In–67Bi low melting alloys on Cu substrates-Reference-Cited by-同舟云学术

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Interfacial reactions of 68In–32Bi, 50In–50Bi and 33In–67Bi low melting alloys on Cu substrates

Published:2019-06 Issue: Volume:759 Page:506-513
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Tseng Tsan-Hsien,Yang Chih-Han,Chiang Jeng-Yu,Huang Jyun-Jhe,Chen Chih-Hao,Lin Shih-Kang,Wang Chang-Meng,Wu Albert T.

Funder

MOST

SHENMAO Technology Inc

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference24 articles.

1. Reliability challenges in 3D IC packaging technology;Tu;Microelectron. Reliab.,2011

2. Metallurgical challenges in microelectronic 3D IC packaging technology for future consumer electronic products;Tu;Sci. China Technol. Sci.,2013

3. Materials challenges in three-dimensional integrated circuits;Chen;MRS Bull.,2015

4. Wafer warpage analysis of stacked wafers for 3D integration;Kim;Microelectron. Eng.,2012

5. In situ measurements of thermal and electrical effects of strain in flip-chip silicon dies using Synchrotron radiation X-rays;Wu;J. Electron. Mater.,2009

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Microstructural observation of Bi67In reacting with Cu for microelectronic interconnects;Journal of the Taiwan Institute of Chemical Engineers;2023-10

2. Effect of Bi addition on the corrosion resistance and mechanical properties of sintered NdFeB permanent magnet/steel soldered joints;Materials Science and Engineering: A;2020-08

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