Microstructural observation of Bi67In reacting with Cu for microelectronic interconnects
Author:
Funder
National Taiwan University
National Science and Technology Council
Publisher
Elsevier BV
Subject
General Chemical Engineering,General Chemistry
Reference22 articles.
1. Review of mocrostructure and properties of low temperature lead-free solder in electronic packaging;Xu;Sci Technol Adv Mater,2020
2. Low temperature bonding technology for 3D integration;Ko;Microelectron Reliab,2012
3. Electrodeposition of nanocrystalline Cu for Cu–Cu direct bonding;Jhan;J Taiwan Inst Chem Eng,2022
4. Low temperature and pressureless Cu-to-Cu direct bonding by green synthesized Cu nanoparticles;Liu;J Taiwan Inst Chem Eng,2021
5. An enhanced thermo-compress in bonding process to address warpage in 3D integration of large die on organic substrates;Sakuma,2015
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