Solid/solid state interfacial reactions in the lead-free solders/Cu- 2.3%wt. Fe alloy (C194) couples-Reference-Cited by-同舟云学术

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Solid/solid state interfacial reactions in the lead-free solders/Cu- 2.3%wt. Fe alloy (C194) couples

Published:2024-02 Issue: Volume:155 Page:105278
ISSN:1876-1070
Container-title:Journal of the Taiwan Institute of Chemical Engineers
language:en
Short-container-title:Journal of the Taiwan Institute of Chemical Engineers

Author:

Yen Yee-Wen^ORCID,Laksono Andromeda Dwi^ORCID,Liou Yi-Chin,Ramadhani Mavindra^ORCID,Lee Yu-Yen,Huang Ssu-Chi

Publisher

Elsevier BV

Subject

General Chemical Engineering,General Chemistry

Reference41 articles.

1. In search of new lead-free electronic solders;Wood;J Electron Mater,1994

2. WEEE Regulations, EU-directive 96/EC, 2002.

3. RoHS Regulations, EU-directive 95/EC, 2002.

4. Effects of Ni modified MWCNTs on the microstructural evolution and shear strength of Sn-3.0 Ag-0.5 Cu composite solder joints;Wang;Mater Charact,2020

5. Lead-free electronics;Ganesan,2006

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