Application of the Taguchi method to minimize the non-uniformity of copper deposition in electroplating with numerical model-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Application of the Taguchi method to minimize the non-uniformity of copper deposition in electroplating with numerical model

Published:2024-03 Issue: Volume:156 Page:105379
ISSN:1876-1070
Container-title:Journal of the Taiwan Institute of Chemical Engineers
language:en
Short-container-title:Journal of the Taiwan Institute of Chemical Engineers

Author:

Yu Shun-Hsuan,Kao Chuan-Ping,Ma Chun-Wei,Fang Jen-Kuang,Yang Ping-Feng,Chang Hou-Chien^ORCID

Publisher

Elsevier BV

Reference28 articles.

1. Fundamentals of electrochemical deposition;Paunovic,2006

2. Nickel-nanoparticles-assisted direct copper-electroplating on polythiophene conductive polymers for PCB dielectric holes;Li;J Taiwan Inst Chem Eng,2019

3. Soft-template-assisted bottom-up fabrication of tunable porosity monolithic copper film for interconnection in microelectronics;Wang;J Taiwan Inst Chem Eng,2023

4. Copper metal for semiconductor interconnects;Cheng;Noble Precious Metal-Propert Nanoscale Effect Appl,2018

5. Electroless copper deposition for ultralarge-scale integration;Hsu;J Electrochem Soc,2001

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP