Application of the Taguchi method to minimize the non-uniformity of copper deposition in electroplating with numerical model-Reference-Cited by-同舟云学术

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Application of the Taguchi method to minimize the non-uniformity of copper deposition in electroplating with numerical model

Published:2024-03 Issue: Volume:156 Page:105379
ISSN:1876-1070
Container-title:Journal of the Taiwan Institute of Chemical Engineers
language:en
Short-container-title:Journal of the Taiwan Institute of Chemical Engineers

Author:

Yu Shun-Hsuan,Kao Chuan-Ping,Ma Chun-Wei,Fang Jen-Kuang,Yang Ping-Feng,Chang Hou-Chien^ORCID

Publisher

Elsevier BV

Subject

General Chemical Engineering,General Chemistry

Reference28 articles.

1. Fundamentals of electrochemical deposition;Paunovic,2006

2. Nickel-nanoparticles-assisted direct copper-electroplating on polythiophene conductive polymers for PCB dielectric holes;Li;J Taiwan Inst Chem Eng,2019

3. Soft-template-assisted bottom-up fabrication of tunable porosity monolithic copper film for interconnection in microelectronics;Wang;J Taiwan Inst Chem Eng,2023

4. Copper metal for semiconductor interconnects;Cheng;Noble Precious Metal-Propert Nanoscale Effect Appl,2018

5. Electroless copper deposition for ultralarge-scale integration;Hsu;J Electrochem Soc,2001

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