The early stage dissolution of Ni and the nucleation of Ni–Sn intermetallic compound at the interface during the soldering of Sn–3.5Ag on a Ni substrate-Reference-Cited by-同舟云学术

The early stage dissolution of Ni and the nucleation of Ni–Sn intermetallic compound at the interface during the soldering of Sn–3.5Ag on a Ni substrate

Published:2010-09-15 Issue:6 Volume:108 Page:063536
ISSN:0021-8979
Container-title:Journal of Applied Physics
language:en
Short-container-title:Journal of Applied Physics

Author:

Lin Yu-Wei,Lin Kwang-Lung

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

http://aip.scitation.org/doi/pdf/10.1063/1.3484493

Reference38 articles.

1. Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization

2. Control of interfacial reaction layers formed in Sn–3.5Ag–0.7Cu/electroless Ni–P solder joints

3. Three‐dimensional morphology of a very rough interface formed in the soldering reaction between eutectic SnPb and Cu

4. Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn–Ag solder and Au/electroless Ni(P)/Cu bond pad

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1. Role of Zn in the Microstructure, Segregation, and Cytotoxicity of Sn-0.2 Ni Solders;ACS Omega;2024-02-16

2. Effects of Twin Boundary and Precipitates on Board Level Reliability in Sn-Ag-Cu(SAC) Solder Joints through EBSD Analysis;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

3. Tuning the Electron Density of Metal Nickel via Interfacial Electron Transfer in Ni/MCM-41 for Efficient and Selective Catalytic Hydrogenation of Halogenated Nitroarenes;ACS Sustainable Chemistry & Engineering;2022-02-21

4. Ag-Ni-Sn Ternary Phase Diagram Evaluation;MSI Eureka;2021-12-30

5. Amorphization and intermetallic nucleation in early-stage interfacial diffusion during Sn-solder/Ni solid-state bonding;Journal of Alloys and Compounds;2021-04